High-Performance Thermal Management Solutions

Inefficient heat dissipation is a primary cause of electronic component failure and performance throttling. FDCL engineers and manufactures high-performance thermal management solutions, including a wide range of heat sinks, designed to efficiently dissipate heat and ensure the reliability of your most critical systems. We provide both standard catalog solutions and fully custom designs.

Complex Heat Sinks
Extruded Heat Sink
Bonded Fin Heat Sink

Standard Parts Catalog

Select from our inventory of standard extruded, stamped, and bonded fin heat sinks. All models can serve as a baseline for further customization.

Part NumberDescriptionDimensions (L x W x H)MaterialThermal Resistance (°C/W)Datasheet (PDF)Quote
FDCL-HS-001-ALExtruded Heat Sink50 x 50 x 25Aluminum 6063-T52.5
FDCL-HS-002-CUStamped Fin Heat Sink40 x 40 x 20Copper C11001.8
FDCL-HS-003-ALBonded Fin Heat Sink60 x 60 x 30Aluminum 60612.1
FDCL-HS-004-ALPin Fin Heat Sink35 x 35 x 15Aluminum 6063-T53.2
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Capabilities & Materials

Our comprehensive thermal management capabilities ensure optimal heat dissipation and reliability in every solution we produce.

Aluminum Alloys (6063-T5, 6061)

Copper (C1100)

A Foundation of Quality, A Partnership in Innovation

Proven Performance Across Industries

Our EMI/RFI shielding solutions are trusted by leaders in the following sectors to protect their most critical assets:

High-Performance Computing & Data Centers

Power Electronics & Inverters

LED Lighting Systems

Automotive Electronics (ECU, Power Modules)

Telecommunications Infrastructure

Medical Device Electronics

Aerospace & Defense Systems

Industrial Motor Drives